What are the functions of the inspection equipment commonly used for SMT placement processing?
SMT chip processing basic process components: screen printing, dispensing, placement, curing, reflow soldering, cleaning, testing, rework.
1、Silkscreen: Its role is to leak the solder paste or patch adhesive to the pads of the PCB, in preparation for the soldering of components. The equipment used is a screen printer (screen printing machine), which is located at the front end of the SMT line.
2、Dispensing: It is to drop glue onto the fixed 1 position of PCB, its main function is to fix the components to the PCB board. The equipment used is a dispensing machine, located at the front of the SMT line or behind the inspection equipment.
3、Placement: Its role is to accurately install the surface assembly components to the fixed 1 position of PCB. The equipment used is a bonder, located behind the screen printing machine in the SMT line.
4, curing: its role is to melt the chip adhesive, so that the surface assembly components and PCB board firmly bonded together. The equipment used is the curing oven, which is located behind the bonder in the SMT line.